Breakthrough in Surface Mounted Technology !
Finally a breakthrough in removing Surface Mounted Devices [SMD's] from printed circuit boards.
Low Temperature Rework
Removes QFP's, PLCC's, SOIC's, and chip components under 150ºC (300ºF).
Fast, Safe, Easy to Use
Eliminates the need for complex expensive equipment. Learn how to desolder SMD's in minutes.
No Expensive Tips or Nozzles
No need to stock a large inventory of tips and nozzles.
No Damage to PC Board or Adjacent Components
No more--burning of board and chips, lifting pads or lands, reflowing adjacent components, damage to double sided boards, throwing PC boards away because of no reliable removal methods.
Simply by adding Chip Quik, normal solder will reflow at a safe low temperature below 150ºC (300ºF).
Benefits from reduced solder reflow temperature:
Eliminate:
- Heat damaged pads, leads and circuitry
- Heat damaged solder joints of adjacent components
- Thermal blisters, burns and board delamination
- Mechanical damage from chip extraction when reflow is incomplete
Benefits from becoming proficient at SMD solder/ desolder rework:
- Save time and money
- reduced labour costs (you become less dependent on others)
- Convenience
- Best of all, fewer boards will be scrapped
It takes a technician 1 or 2 tries to perfect the process.
Remove QFPs, PLCCs, SOICs and chip components without complex and costly equipment. A large inventory stock of heater tips and nozzles are not required.
LOW COST: Available in complete kits for field service or industrial packaging for rework departments. No shelf life! No investment required. Use ChipQuik with existing rework equipment or temperature controlled soldering irons.
REDUCE HEAT - REDUCE DAMAGE
Our Code:
CHIPQUIK
To request more information, pricing or to contact a sales representative at Fero.