Interflux® Electronics stands not only for a leading manufacturer of soldering chemicals (soldering fluxes, solder pastes, solder wires and accessories), but also for an extensive know-how in the soldering technologies.
Interflux aims to provide you with SOLUTIONS FOR SOLDERING
60% Tin/40% Lead
- 2% No-Clean Flux, leaves minimal transparent residue
- Melting point around 183-191ºC
- General Purpose soldering, for bench work
Click Here to see what IFNC-81 series solder we have available ex stock
60% Tin/40% Lead
- 1.4% No-Clean 100% Colophony-Free, rosin free, low fume, halide free Flux
- Melting point around 183-191ºC
- Assembly and Rework soldering
Click Here to see what IF14-14A series solder we have available ex stock
63% Tin/37% Lead
- 1.4% No-Clean 100% Colophony-Free, rosin free, low fume, halide free Flux
- Eutectic melting point 183ºC
- Assembly and Rework soldering
Click Here to see what IF14-14B series solder we have available ex stock
62% Tin/36% Lead/2% Silver
- 1.4% No-Clean 100% Colophony-Free, rosin free, low fume, halide free Flux
- Eutectic melting point 179ºC
- SMD soldering
Click Here to see what IF14-14C series solder we have available ex stock
same as IF14-14 series above but with only 0.9% flux
Click Here to see what IF14-09 series solder we have available ex stock
same as IF14-14 series above but with only 0.6% flux
Click Here to see what IF14-06 series solder we have available ex stock
No Clean Solder Paste
Available in 5 different variants for different applications.
Screen Printing:
- 89% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
Proflow (DEK):
- 89% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
Rheopump (MPM):
- 89% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
Paste Puck:
- 89% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
Dispensing:
- 84% Metal Content by weight
- 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
No Clean Solder Paste
Available in 2 different variants for different applications.
Screen Printing:
- 89% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
Dispensing:
- 84% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
No Clean Solder Paste
Available in 1 variant for different applications.
Screen Printing:
- 89% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
No Clean "Lead Free" Solder Paste
Available in 2 different variants for different applications.
Screen Printing:
- 86% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
Dispensing:
- 82% Metal Content by weight
- 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
No Clean "Lead Free" Solder Paste
Available in 2 different variants for different applications.
Screen Printing:
- 88% Metal Content by weight
- 45 - 75µ, 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
Dispensing:
- 82% Metal Content by weight
- 25 - 45µ, 20 - 38µ & 15 - 25µ Powder Size following IPC
No Clean Flux - Alcohol Based, No Residue
- 1.8% Solid Content
- 15mg KOH/g Acid Number
- Not VOC Free
- Foams
- Sprayable
No Clean Flux - Alcohol Based, No Residue
- 3.6% Solid Content
- Not VOC Free
- Foams
- Sprayable
No Clean Flux - Water Based, VOC-Free, No Residue
- 3.7% Solid Content
- 24mg KOH/g Acid Number
- VOC Free
- No Foam
- Sprayable
No Clean Flux - Water Based, VOC-Free, No Residue
- 4.5% Solid Content
- VOC Free
- No Foam
- Sprayable
No Clean Flux - Water Based, VOC-Free, No Residue
- 3.7% Solid Content
- 24mg KOH/g Acid Number
- VOC Free
- No Foam
- Sprayable
No Clean Flux - Water Based, VOC-Free, No Residue
- 2.5% Solid Content
- 16mg KOH/g Acid Number
- VOC Free
- Foam
- Sprayable
No Clean Flux - Alcohol Based
- 3.7% Solid Content
- Not VOC Free
- Foam
- Sprayable
No Clean Flux - Alcohol Based
- 1.5% Solid Content
- 12mg KOH/g Acid Number
- Not VOC Free
- Foam
- Sprayable
No Clean Flux - Alcohol Based
- 1.8% Solid Content
- 15mg KOH/g Acid Number
- Not VOC Free
- Foam
- Sprayable
No Clean Flux - Alcohol Based
- 3.3% Solid Content
- 27mg KOH/g Acid Number
- Not VOC Free
- Foam
- Sprayable
No Clean Flux - Alcohol Based
- 5.7% Solid Content
- Not VOC Free
- Foam
- Sprayable
No Clean Flux - Alcohol Based
- 7.0% Solid Content
- Not VOC Free
- Foam
- Sprayable
No Clean Flux - Alcohol Based
- 15.0% Solid Content
- Not VOC Free
- Foam
- Sprayable
Non Refillable Flux Pen
- IF 8001 flux
- Low Residue
- Felt Tip
- 10cc
Our Code:
IFFLUXPEN
Refillable Flux Pen - IF 8001 flux
- Low Residue
- Felt Tip or Soft Brush options
- 10cc
BGA Flux
- BGA/SMT Repair Flux with High Tackness
- 10cc syringe and other sizes available
Our Code:
IF8300BGA
The SlimLine series offers the total solution to retrofit a Spray Fluxer System into all existing Wave Soldering Machines. The Spray Nozzle Flux supply is controlled by gravity, pressurized tank or air-pump through a Venture System. It gives the user complete flexibility and process control. The available systems are user friendly and easy to maintain.
Key Benefits:
- 50 % reduction of Flux consumption
- Eliminates the usage of thinner
- Good solderability , due to continuous fresh Flux supply
- Easy maintenance
- Can spray all types of Fluxes
There are 6 Models available.
Below is an example of one unit available
ICSF-SL-Pro-SA
Stand Alone model
Dimensions (L x W x H):-
Control Panel with flux cabinet:
650 mm x 260 mm x 1500 mm
Spray Fluxer Module:
560 mm x 160 mm x 165 mm
Conveyor :
900 mm x 1000 mm x 835 mm
Features :
- Pressurized Tank
- conveyor speed integration
- Incoming PCB-sensor
- touch screen
- maintenance mode
- accurate flow display
- three-position tower light
- emergency stop
- Conveyor with adjustable width
- build-in exhaust hood with drainage
- Smart width spray system
Retrofit your Stencil Printer Machine with the PuckPackTM System and enjoy the following benefits :
- Cost saving
- No solder paste dry out
- No squeegees needed
- Minimum setup time
- Minimum waste of solder paste
- Process repeatability
- High speed printing
- Less cleaning
Available for a variety of machines including DEK, MPM, MPM-Prohead & EKRA (pictured)
Using Anti-Oxidant Solder Pellets and De-Oxidation Oil will minimise the risk of:
- Floating particles in the solder
- Poor heat transfer
- Lumpy solder
- High dross formation leading to excessive solder consumption
- Dirty PCB's
- Micro bridging
What does it mean for you:
- Up to 50% cost saving in consumption of solder bars
- Double reduction of dross
- Improving quality of solder
- Enhancing solderability
- Prevents dross formation
- Reduces the oxides that are in the solder bath by using the de-oxidation oil. - Removes the black powder that results from the de-oxidation treatment. The result must be a clean solder bath without oxides.
- Prevents dross formation
- Reduces the oxides that are in the solder bath by using the de-oxidation oil.
- Removes the black powder that results from the de-oxidation treatment. The result must be a clean solder bath without oxides.
To request more information, pricing or to contact a sales representative at Fero.
09 274 0104
ASK US
