Fero's Moldman low-pressure injection molding machine uses Henkel's Macromelt® materials to provide gentle over molding and encapsulation for delicate electronic components.
The innovative, modified, thermoplastic, polyamide, hot melts are made especially for low-pressure molding and are a cost effective alternative to epoxy potting.
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Terminated housings
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Connectors
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PCB's
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Pressure sensitive components
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Temperature sensitive components
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Strain reliefs and grommets
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Promotional products
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We use the latest super adhesive Macromelt® products to bond to a wide range of host products to give waterproofing properties whilst maintaining high insulative properties.
Macromelt® information can be found at www.macromelt.com
Benefits of low pressure molding:
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Low tooling cost
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Short production runs
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Cost effective for prototypes
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Bondiing properties to parent material when ovemolding
Fero can offer:
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Engineering and design expertise
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Short lead-time production
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Rapid tooling and sampling
To request more information, pricing or to contact a sales representative at Fero.